SK hynix H9TQ26ADFTAC eMCP Memory Solution Datasheet
This page provides the technical specification and reference datasheet for the SK hynix H9TQ26ADFTAC eMCP memory solution. This highly integrated Embedded Multi-Chip Package (eMCP) combines high-density eMMC NAND Flash and high-speed LPDDR3 DRAM into a single compact package, making it ideal for mobile devices, smart IoT equipment, and embedded systems.
📌 Technical Inquiry & Reference
- 📥 Download SK hynix H9TQ26ADFTAC eMCP PDF Datasheet
- For technical specifications, volume pricing, and design-in support, please refer to our official reference page:
👉 SMC H9TQ26ADFTAC Reference Page - Direct link for technical specification lookup: https://www.sourcememorychips.com/products/hqtq26adftac
1. Product Overview
The SK hynix H9TQ26ADFTAC integrates storage memory and system memory into one embedded package, helping hardware designers reduce PCB footprint, simplify hardware design, and improve overall system integration efficiency.
- Manufacturer: SK hynix
- Part Number: H9TQ26ADFTAC
- Product Type: eMCP (embedded Multi-Chip Package)
- Memory Integration: eMMC NAND Flash + LPDDR3 DRAM
- Package Type: FBGA
- Application: Mobile & Embedded Systems
2. Memory Architecture
| Memory Block | Function |
|---|---|
| eMMC NAND Flash | Non-volatile storage for operating system, firmware, applications, and user data. |
| LPDDR3 DRAM | High-speed system memory supporting system operation and application processing. |
Memory Block Diagram
H9TQ26ADFTAC eMCP
├── eMMC NAND Flash (Storage Memory)
└── LPDDR3 DRAM (System Memory)
↓
Host Processor / Embedded System
3. Product Advantages
- Compact Memory Integration: Combined storage and system memory in one tiny package.
- Reduced PCB Footprint: Maximizes board space efficiency.
- Simplified Hardware Design: Streamlines circuitry design for faster time-to-market.
- High Reliability: Designed for stable operation in embedded systems.
- Long Lifecycle Support: Ideal for industrial and long-life electronic applications.
4. Technical Specifications
- NAND Technology: eMMC NAND Flash
- DRAM Technology: LPDDR3 SDRAM
- NAND Density: TBD
- DRAM Density: TBD
- Interface: TBD
- Operating Voltage: TBD
- Package: FBGA
- Operating Temperature: TBD
Disclaimer: Technical specifications are based on standard SK hynix product information. For latest factory errata, active part statuses, or official price sheets, please consult Source Memory Chips. ```