SK hynix H9TP65A8JDAC Legacy eMCP Datasheet & Technical Specifications

This page provides the technical specifications and reference datasheet for the SK hynix H9TP65A8JDAC legacy eMCP device. This Embedded Multi-Chip Package (eMCP) is highly optimized for legacy mobile platforms, handheld terminals, and space-constrained compact embedded systems, combining 8 GB of embedded NAND/eMMC flash storage with 1 GB of LPDDR2 SDRAM.

📌 Technical Inquiry & Reference


1. Product Overview

The SK hynix H9TP65A8JDAC is an Embedded Multi-Chip Package (eMCP) designed to reduce PCB footprint, simplify hardware design, and streamline system integration in compact systems.

  • Manufacturer: SK hynix
  • Part Number: H9TP65A8JDAC (Base Identifier)
  • Product Type: Legacy eMCP / Embedded Multi-Chip Package
  • Memory Integration: 8 GB embedded NAND/eMMC + 1 GB LPDDR2 SDRAM (Reference Configuration)
  • Package Type: FBGA162 Commonly Listed
  • Target Platforms: Mobile, handheld, and compact embedded systems

2. Memory Architecture

Memory Block Function
8 GB embedded NAND/eMMC Non-volatile storage for boot code, operating system, firmware, applications, and user data.
1 GB LPDDR2 SDRAM Volatile system memory supporting processor operation and application execution.

Memory Block Diagram

H9TP65A8JDAC eMCP
├── 8 GB embedded NAND/eMMC (Non-volatile storage)
└── 1 GB LPDDR2 SDRAM (System memory)
     ↓
Host Processor / Mobile or Embedded System

3. Product Advantages

  • Integrated Memory: Combines non-volatile storage and system memory in one compact FBGA162 package.
  • PCB Efficiency: Significantly reduces board area, component count, and memory routing complexity.
  • Legacy Platform Support: Highly suitable for the maintenance, repair, and replacement sourcing of compatible legacy platforms.
  • Component Optimization: Ideal for space-constrained and energy-efficient designs.

4. Technical Specifications

  • Manufacturer: SK hynix
  • Part Number: H9TP65A8JDAC
  • Product Family: Legacy eMCP / embedded multi-chip memory
  • Storage Memory: 8 GB embedded NAND/eMMC (commonly referenced configuration)
  • System Memory: 1 GB LPDDR2 SDRAM (commonly referenced configuration)
  • Interface: Device- and suffix-specific; verify official manufacturer documentation
  • Package: FBGA162 commonly listed; verify complete package suffix
  • Electrical / Temperature Limits: Please verify before design or replacement use

Disclaimer: All specifications shown reflect commonly available product references. Before ordering or procurement, please confirm the complete top marking, package suffix, and original board compatibility against Source Memory Chips. ```